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Suitable for water and UV curing systems. Provides rapid leveling, significantly reduces surface tension. Works in a wide temperature range. Resistant to hydrolysis.

Reduces the surface tension of the system, ensures wetting of the substrate, does not stabilize the foam.

Suitable for water-based and UV-curable systems. Provides rapid leveling, significantly reduces surface tension, does not affect sliding, perfectly wets the substrate.

Significantly reduces surface tension, perfectly wets the substrate, is able to extinguish foam, improves leveling, does not affect sliding

Suitable for water and organosoluble systems. Perfectly wets the substrate, prevents the formation of

Suitable for water-based and organosoluble systems. Perfectly wets the substrate, prevents crater formation, does not affect sliding.

Suitable for water-based and UV-curable systems. Significantly reduces surface tension, provides leveling, does not affect sliding, works in the pH range of 6 - 8.

Reduces the surface tension of the system, ensures wetting of the substrate, does not provoke foam.

Suitable for water and UV curing systems. Significantly reduces surface tension, provides leveling, does not affect sliding, works in the pH range of 6 -8.

Significantly reduces the surface tension of the system and perfectly wets the substrate. Improves fluidity and leveling.

Significantly reduces the surface tension of the system and perfectly wets the substrate. Does not stabilize foam,

Suitable for water systems, excellent substrate wetting, prevents cratering, does not affect sliding.

Suitable for water systems, excellently wet the substrate, prevents cratering, does not affect sliding. Significantly reduces the surface tension of the system and excellently wets the substrate. Improves fluidity and leveling.