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Reduces the surface tension of the system, ensures wetting of the substrate, does not stabilize the foam.

Suitable for water-based and UV-curable systems. Provides rapid leveling, significantly reduces surface tension, does not affect sliding, perfectly wets the substrate.

Suitable for water and organosoluble systems. Perfectly wets the substrate, prevents the formation of

Suitable for water-based and organosoluble systems. Perfectly wets the substrate, prevents crater formation, does not affect sliding.

Reduces the surface tension of the system, ensures wetting of the substrate, does not provoke foam.

Suitable for water and UV curing systems. Significantly reduces surface tension, provides leveling, does not affect sliding, works in the pH range of 6 -8.

Suitable for water systems, excellent substrate wetting, prevents cratering, does not affect sliding.