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Suitable for water and UV curing systems. Provides rapid leveling, significantly reduces surface tension. Works in a wide temperature range. Resistant to hydrolysis.

Significantly reduces surface tension, perfectly wets the substrate, is able to extinguish foam, improves leveling, does not affect sliding

Suitable for water and organosoluble systems. Perfectly wets the substrate, prevents the formation of

Suitable for water and UV curing systems. Significantly reduces surface tension, provides leveling, does not affect sliding, works in the pH range of 6 -8.

Suitable for water systems, excellently wet the substrate, prevents cratering, does not affect sliding. Significantly reduces the surface tension of the system and excellently wets the substrate. Improves fluidity and leveling.