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Contains unsaturated double bonds, suitable for radiation-curing systems. Reacts with resin and inorganic substrate. Improves adhesion, moisture resistance, heat resistance, resistance to salt fog.

Contains unsaturated double bonds, can react with resin and substrates. Can participate in crosslinking of UV-curable systems. Improves paint durability. Used for surface treatment of fillers.

Contains unsaturated double bonds, suitable for radiation-curing systems. Can react with resin and inorganic substrate. Improves moisture resistance, heat resistance, resistance to salt fog.

Contains epoxy groups, improves adhesion to inorganic substrates. Can participate in crosslinking, improves paintwork durability. Used for surface treatment of fillers.