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Contains unsaturated double bonds, suitable for radiation-curing systems. Reacts with resin and inorganic substrate. Improves adhesion, moisture resistance, heat resistance, resistance to salt fog.

Contains unsaturated double bonds, can react with resin and substrates. Can participate in crosslinking of UV-curable systems. Improves paint durability. Used for surface treatment of fillers.

Contains unsaturated double bonds, suitable for radiation-curing systems. Can react with resin and inorganic substrate. Improves moisture resistance, heat resistance, resistance to salt fog.

Good compatibility with resins, improves paint adhesion, moisture resistance, and resistance to salt-mutuman.

Good compatibility with thermosetting systems. Can participate in crosslinking of paint and varnish coatings. Promotes adhesion to metal substrates, improves impact resistance.

Contains epoxy groups, improves adhesion to inorganic substrates. Can participate in crosslinking, improves paintwork durability. Used for surface treatment of fillers.

Good compatibility with resins, can react with melamine resins, NCO groups. Significantly improves adhesion to metals, moisture resistance, resistance to salt fog.

Developed for melamine thermosetting paints and varnishes, improves adhesion to metals. Good compatibility. Suitable for PU systems.

Contains amino groups, designed for inorganic substrates and for processing fillers. Can participate in cross-linking. Suitable for EP, PU systems.

Contains amino groups, designed for inorganic substrates for processing fillers. Can participate in cross-linking. Suitable for EP, PU systems.

Contains anchor groups that are excellently adsorbed on various hard-to-wet surfaces (stainless steel, nylon). Improves resistance to salt fog, moisture resistance, and adhesion to glass.